June 7, 2012
Michael Casper, CEO and CTO, UltraSource, Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced today the new CopperVia(TM), based on the existing patented UltraVia(TM) process. The CopperVia(TM) will be introduced at 2012 IEEE MTT-S International Microwave Symposium/Exhibition, June 19th - 22nd at Palais des congres de Montreal, Quebec, Canada, booth 2802. UltraSource's new CopperVia(TM) process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia(TM), the CopperVia(TM) virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.